ASUS Announces AMD EPYC 9004-Powered Rack Servers and Liquid-Cooling Solutions

• Superior liquid-cooling solutions: Over 90%-lower fan power consumption for huge saving on data-center operations
• New thermal design: Hard-drive tray design with 44%-wider ventilation holes, plus optimized layout to minimize impedance and enhance airflow
• No. 1 Benchmark: World-record-setting performance with 24 results on the latest SPEC CPU2017 and SPECjbb

ASUS, a leading provider of server systems, server motherboards and workstations, today announced new best-in-class server solutions powered by the latest AMD EPYC™ 9004 Series processors. ASUS also launched superior liquid-cooling solutions that dramatically improve the data-center power-usage effectiveness (PUE).

The breakthrough thermal design in this new generation delivers superior power and thermal capabilities to support class-leading features, including up to 400-watt CPUs, up to 350-watt GPUs, and 400 Gbps networking.

Sustainable design for HPC data centers

Leveraging innovative ASUS thermal design, ASUS rack server solutions empower enhanced system airflow — minimizing power consumption and maximizing efficiency. The lower power consumption aligns with the ASUS 2025 Sustainability Goals initiative, which aims to bring about proactive and positive change. The new hard-drive tray design on the front panel of the RS series servers features ventilation holes that are 44% wider compared to the previous generation, increasing airflow through the system and improving thermal efficiency. This adds to component longevity, including the latest DDR5, PCIe® 5.0 and NVMe® technologies. The improved fan-tunnel design, with independent CPU- and GPU-airflow tunnels, increases the capabilities of 400 W CPUs and 350 W GPUs — significantly boosting compute-intensive enterprise workloads.

Comprehensive liquid-cooling solutions

Increased power consumption, higher CPU TDP and ever-more-powerful GPUs present challenges for server markets and data-center operators. The latest RS720QA-E12 high-density server, cooled via direct-to-chip (D2C) technology, stands out from the competition to deliver over 90%-lower fan power consumption and over 29.6%-lower noise levels — empowered by ASUS Thermal Radar 2.0 and Power Balancer technologies. ASUS is working with industry-leading immersion-cooling partner, Submer and MGC, to deliver comprehensive liquid-cooling solutions — from servers to liquid-cooling modules, data-center floor plans, capability evaluations and suggested infrastructure.

World-record-setting ASUS EPYC 9004 server solutions

AMD EPYC 9004-series processors amplify the AMD history of x86 architecture innovations and record-breaking performance with next-generation 5 nm technology. They also introduce support for high-performant DDR5 DIMMs, 128 PCIe 5.0 lanes and 12 memory channels, delivering the resources needed for memory-hungry AI, ML, HPC and large in-memory computations. ASUS continues its performance leadership by achieving 24 benchmark world records on SPEC CPU2017 and SPECjbb with dual-socket RS700A-E12 and single-socket RS520A-E12 servers.

These latest ASUS servers, powered by AMD EPYC 9004-series processors, include the dual-socket RS720A-E12 and RS700A-E12, and the single-socket RS520A-E12 and RS500A-E12; plus the density-optimized RS720QA-E12 and the ESC8000A-E12 and ESC4000A-E12 GPU servers. All ASUS GPU servers are NVIDIA-Certified to support NVIDIA® AI Enterprise and Omniverse solutions. All ASUS servers powered by AMD EPYC 9004-series processors are certified by VMware, Microsoft Windows Server and Linux.

Learn more about ASUS EPYC 9004 server solutions