Winbond HYPERRAM™ 3.0 wins 7th China IoT Innovation Awards 2022
Established by Elecfans, a leading electronic media in China, the China IoT Innovation Awards has been recognized as one of the most professional, influential evolutions in Chinese IoT industry. The China IoT Innovation Awards aims to discover and recognize outstanding technologies and leaders in the IoT industry, as well as innovative products that have been highly valued and recognized by the market and industry users in the past years, so as to inspire more people to empower the advancement of IoT technology and development of the industry.
The HYPERRAM product range offers compact alternatives to traditional pseudo-SRAM and is well-suited to low power, space-constrained IoT applications that require an off-chip external RAM. HYPERRAM 3.0 is the third generation of the HYPERRAM family that operates at a maximum frequency of 200MHz with a 1.8V operation voltage, which is the same as both HYPERRAM 2.0 and OCTAL xSPI RAM, but with an increased data-transfer rate of 800MBps – double the rate that was previously available. The new generation HYPERRAM operates via an expanded IO HYPERBUS™ interface with 22 pins.
Low pin count, low power consumption and easy control are three key features of HYPERRAM that help it significantly improve the performance of IoT end devices. HYPERRAM significantly simplifies the PCB layout design, extends mobile devices‘ battery life, and works with a smaller processer via a lower pin count while increasing throughput compared to low-power DRAM, SDRAM, and CRAM/PSRAM.
According to IResearch, China’s AIoT industry has entered a period of rapid growth in 2022, with a corresponding surge in demand for IoT chips and smart devices. The HYPERRAM 3.0 won the China IoT Technology Innovation Award is a high recognition of Winbond’s continuous innovation. The HYPERRAM family is ideal for low-power IoT applications, such as wearables, instrument clusters in automotive applications, infotainment and telematics systems, industrial machine vision, HMI displays and communication modules.
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About Winbond
Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and new Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products.
More information may be found at https://www.winbond.com/hq?__locale=en
Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.
Macnica’s ATD Europe GmbH, (former Macnica GmbH), was originally established in the UK in 2006, and moved to Germany in July 2008, to increase efficacy of its service for European customers.
By it’s acquisition of the Munich based company Scantec Mikroelektronik in 2014 Macnica Europe formed a powerful semiconductor distribution with headquarter in Ingolstadt and offices in Munich, Regensburg, Milton Keynes (UK) and Warsaw of-fering an attractive and competitive portfolio of highly sophisticated devices.
Macnica provides end to end support from design-in to production through its global service network to its customers, regardless of the final destination of the product shipment to customers‘ manufacturing locations.
About Macnica ATD Europe S.A.S.
Founded in 1990 as ATD Electronique, Macnica ATD Europe headquarter offers in-novative components dedicated to imaging applications for the European market. Its product portfolio includes: image sensors (CCD, CMOS, InGaAs, Thermal etc.), op-tics, interface circuits, FPGA & IPs, imaging processors, cables and OLED micro-displays.
It also covers development tools and design services enabling fast and efficient reali-zation of new high-performance camera systems for markets such as machine vision, medical, life sciences, surveillance, automotive and others. After the acquisition of the company by Macnica Inc. as of October 1, 2020 the company operates under the name Macnica ATD Europe.
About Macnica, Inc.
Macnica was established in 1972 as a semiconductor distribution company headquar-tered in Yokohama, Japan, and has over 85 sales offices worldwide in eastern Asia, Europe and the USA. Total number of employees is over 3,900 and its consolidated revenue for fiscal 2021 was approximately US$ 7.6 B.
Macnica is famous for having an excellent engineering team of more than 900 appli-cation support engineers, IC designers and software developers with strong focus on providing technical support for its customers including custom design services. Mac-nica is continuing to extend its presence globally by having successful partners in strategic areas in the electronics market.
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