Case Study: AI-Powered Failure Analysis and Inspection System Finds Issues Faster
Using 20 MP Blackfly S cameras, Instrumental imaging stations capture high levels of detail required for inspecting small electronic micro assemblies where very small errors can lead to failures (among several other applications).
Unique features and ease of integration provided by Spinnaker SDK combined with our renowned 20 MP Blackfly S USB3 cameras were ideal for Instrumental’s manufacturing optimization platform. The system aggregates images and functional test data from throughout the supply chain, leveraging artificial intelligence to automatically rank potential root causes, enabling customers to accelerate issue resolution, gain faster yield, and improve quality. Read along to learn more and contact a specialist about Instrumental’s inspection solutions and Teledyne FLIR machine vision cameras.
- How Instrumental’s inspection platform delivers automated defect detection
- Platform features that combine root cause analysis and reporting
- Benefits of secure product data management, and native collaboration tools
- Why Instrumental chose Teledyne FLIR’s 20 MP Rolling Shutter CMOS
- Unique features, ease of use and integration enabled by Spinnaker SDK
- How Teledyne FLIR enables Instrumental an easily customizable setup
Teledyne DALSA
Lise-Meitner-Str. 7
82152 Krailling (Munich)
Telefon: +49 (89) 89545730
Telefax: +49 (89) 895457346
http://www.teledynedalsa.com