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ADLINK Partners with SimProBot to Launch Tallgeese AI On-Premise Workstation Solution, Boosting Enterprise Productivity with Generative AI
Ecosystem Partnership: ADLINK and SimProBot have signed a memorandum of understanding (MOU) to collaborate on building an on-premise AI workstation solution for enterprises. Ideal for Enterprise On-Premise Application: Efficient, secure, and easy to use. It is tailored for internal use by enterprise clients, protecting industry know-how and trade secrets. End-to-End Solution with Quick Delivery: Accelerates industrial automation’s digital transformation for enterprises by fully integrating hardware and software. ADLINK Technology (Stock Code: 6166), a global leader in edge computing solutions, announced a partnership with U.S.-based SimProBot to launch a dedicated on-premise generative AI solution for enterprises. By combining ADLINK’s AI GPU servers and Tallgeese AI software, the solution can deliver robust…
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ADLINK Unveils Next-Generation Railway Technology at InnoTrans 2024
Summary: ADLINK will introduce the Passenger Information Display System (PIDS) and CompactPCI Systems and Cards. Visitors can experience the power of AI in railway applications with the AVA-series product family. ADLINK Technology Inc., a global leader in edge computing, will showcase its latest innovations in railway technology at InnoTrans 2024. The booth will feature three main sections, each dedicated to highlighting a unique aspect of their cutting-edge solutions: Passenger Information Display Systems (PIDS) Experience: ADLINK’s latest PIDS solutions, developed in collaboration with AUO, showcase the future of passenger information systems. Visitors to the stand can explore interactive displays with different sizes and see firsthand how this technology enhances passenger…
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ADLINK Unveils the New SBC35 Series: 3.5” Single Board Computers Tailored for Compact Efficiency
. Summary: All-New ADLINK SBC35 Series: Compact 3.5” single board computers designed for space-constrained applications. Robust Processing Options: Includes efficiency-optimized Intel N97 and high-performance 13th-gen Intel Core i7/i5/i3/Celeron options. Extensive Connectivity and Innovative Expansion: Provides diverse native I/O capabilities and customizable SBC-FM function modules for enhanced I/O expansion. ADLINK Technology Inc., a global leader in edge computing and a renowned supplier of industrial PCs and motherboards, is proud to announce the launch of the new SBC35 Series of 3.5” Single Board Computers (SBC). This innovative series introduces a range of motherboards specifically engineered to maximize efficiency in compact spaces. The SBC35 Series features two models: the high-performance SBC35-RPL, powered by…
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ADLINK Launches IMB-C Value Series ATX Motherboards
Summary: Cost-effective ATX motherboards optimized for budget, with essential performance and uncompromised reliability. Broad-range Intel Core processor support, ensuring versatility across various applications in multiple environments. Robust connectivity with extensive I/O capabilities for industrial applications like warehousing, industrial automation, smart manufacturing, and new energy. ADLINK Technology Inc., a global leader in edge computing, and a global supplier of industrial PCs and motherboards, announces the launch of the new IMB-C Value Series of ATX motherboards, extending the IMB series motherboard range with new, more affordable, options for users seeking high-performance at a lower price point. The IMB-C value series comes with processor options ranging from Gen 10 to Gen 14 Intel…
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ADLINK champions embedded computing market with the 662-pin OSM form factor by SGET
Summary: Open Standard Module™ (OSM), measuring just 45mm x 45mm, streamlines production with zero overhead modular systems and offers 662 pins for enhanced miniaturization and IoT applications. ADLINK offers OSM-IMX93 and OSM-IMX8MP based on NXP i.MX 93 and NXP i.MX 8M Plus respectively, pioneering OSM form factor and demonstrating continued breakthroughs in embedded computing. ADLINK Technology Inc., a global leader in edge computing, introduces Open Standard Module™ (OSM) by SGET, a compact yet powerful form factor revolutionizing embedded computing. Having crafted as a member of the SGET committee, ADLINK played a pivotal role in establishing its presence in the industry. OSM modules represent a new pinnacle in compact, open…
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ADLINK Unveils Next-Generation Railway Solutions: AVA-7200, AVA-1000, and Passenger Information Display System (PIDS)
Summary: ADLINK introduces AVA-7200, AVA-1000, and Passenger Information Display System (PIDS), leading the way in railway technology. AVA-7200 and AVA-1000 enhance safety, efficiency, and connectivity in railway operations with advanced AI computing capabilities. PIDS offers selectable display solutions with ADP Tartan Technology, catering to diverse needs in the railway industry. For media inquiries kindly contact: media@adlinktech.com With a legacy of innovation spanning decades in the railway industry, ADLINK Technology Inc. proudly announces the launch of its latest products, including the AVA-7200 edge AI server, AVA-1000 train to ground gateway, and Passenger Information Display System (PIDS). These cutting-edge solutions mark a significant milestone in ADLINK’s commitment to advancing railway technology…
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ADLINK introduces award-winning ARM-based Panel PC
Summary: Industrial, ARM-based Panel PC powered by NXP i.MX8M Plus high-performance processor with 32GB embedded MultiMedia Card (eMMC) and external Micro SD slot for storage expansion Flexible configuration: modularity: speed: energy efficiency: superior connectivity: longevity Helps system integrators, integrated solution providers and brand vendors quickly deliver cutting-edge functions to individual HMI applications Previewed at Embedded World 2024 where it won Best In Show – judged on design excellence, relative performance and market impact ADLINK Technology Inc., a global leader in edge computing, has launched the SP2-IMX8 7”/10” open frame panel PC (with 2.5” Pico-ITX SBC). Based on ARM architecture, this truly flexible solution can also be configured as a media…
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ADLINK Technology and Rutronik sign cooperation agreement
Summary: ADLINK is expanding its market penetration and presence in EMEA through a strategic partnership with broadline distributor Rutronik. Rutronik expands its product offering through the co-operation and strengthens its position as one of the leading embedded distributors for industrial computing with extensive market expertise. Customers will benefit from the combined expertise of both companies and a wide range of products and services, from Computer-on-Module (CoM) solutions to complex, application-specific complete systems. The cooperation expands the offering for mission-critical edge computing applications in key sectors such as industrial automation and medical technology. ADLINK Technology Inc., a global leader in edge computing, and Rutronik Elektronische Bauelemente GmbH, a global broadline distributor,…
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ADLINK Technology und Rutronik unterzeichnen Kooperationsvertrag
Zusammenfassung: ADLINK baut durch die strategische Partnerschaft mit Broadline-Distributor Rutronik seine Marktdurchdringung und Präsenz in EMEA aus. Rutronik erweitert durch die Kooperation sein Produktangebot und stärkt seine Position als einer der führenden Embedded-Distributoren für den Industriecomputerbau mit umfassender Marktexpertise. Kunden profitieren von der kombinierten Fachkompetenz beider Unternehmen und einem breiten Produkt- und Leistungsspektrum, das von Computer-on-Module (CoM)-Lösungen bis hin zu komplexen, anwendungsspezifischen Gesamtsystemen reicht. Die Kooperation weitet das Angebot für missionskritische Edge-Computing-Anwendungen in Schlüsselbranchen wie der industriellen Automation oder der Medizintechnik aus. ADLINK Technology Inc., ein weltweit führender Anbieter von Edge Computing, und die Rutronik Elektronische Bauelemente GmbH, ein global agierender Broadline-Distributor, gehen eine strategische Partnerschaft ein. Diese Kooperation ermöglicht…
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ADLINK releases Intel® Amston-Lake-powered modules with up to 8 cores at 12W TDP suiting ruggedized edge solutions
Summary: 1. ADLINK introduces two new modules, one COM Express and one SMARC, based on the latest Intel® Atom processors cExpress-ASL:0 R3.1 Type 6 Compact size module with 2/4/8-core Intel Atom x7000RE & x7000C series, up to 16GB LPDDR5 memory, 8 PCIe Gen3, and 2.5GbE at 6/9/12W TDP LEC-ASL: SMARC 2.1 Short size module with 2/4/8-core Intel Atom x7000RE & x7000C, up to 16GB LPDDR5, 2x 2.5GbE, and 2x MIPI CSI support at 6/9/12W TDP 2. With soldered-down memory and extreme temperature options, the modules can fulfill various high-performance, low-power, and ruggedized edge solutions running 24/7. 3. Supporting Intel® TCC, and Time Sensitive Networking (TSN), the modules fit hard-real-time…
