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Ausgezeichnet: congatec’s Kundensupport bei großen geschäftlichen Herausforderungen und technologischem Wandel
congatec – ein führender Anbieter von Embedded und Edge Computer Technologie – hat von VDC Research den Platinum Vendor Satisfaction Award für IoT & Embedded Hardware Technologie erhalten. Ausschlaggebend für die Auszeichnung ist congatec‘s herausragende Unterstützung seiner Kunden bei großen geschäftlichen Herausforderungen und technologischem Wandel. Die Auszeichnung basiert auf der Zufriedenheitsbewertung der Anbieter durch mehr als 700 IoT-, Embedded- und Edge-Lösungsanbieter, die kommerzielle Hardware-Plattformen beziehen. Die Liste umfasst OEMs, Systemintegratoren und Entwicklungsdienstleister. „Die Anforderungen an Design und Entwicklung werden nicht einfacher – ebenso wenig das makroökonomische Umfeld mit seinen vielfältigen weltweiten geopolitischen, ökologischen und liefertechnischen/logistischen Herausforderungen. Es ist deshalb heute wichtiger denn je, einen starken Hardware-Technologieplattform-Anbieter zu haben, um in…
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Making the robotic edge modular
congatec – a leading vendor of embedded and edge computing technology – announced today that Intel Labs China has chosen congatec COM Express modules for easy and efficient design-in and flexible processor scalability in its Heterogeneous Extensible Robot Open (HERO) platform. Created by the Autonomous System Lab of Intel Labs China to simplify and accelerate the development of next-generation IoT connected service robots, retail robots, and self-driving vehicles, the Robot 4.0 platform integrates artificial intelligence (AI) for research, education, and experimental purposes. The open platform combines Intel’s heterogeneous processor technology with Intel’s OpenVINO AI toolkit and offers a comprehensive suite of software libraries for localization, navigation, planning, and human-robot interaction.…
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An advance into the world of mixed-critical real-time servers
congatec – a leading vendor of embedded and edge computing technology – extends its Intel Xeon D-2700 processor based Server-on-Module portfolio by launching five new modules in the compact (160x160mm) COM-HPC Server Size D performance class. The launch underlines the massive industry demand for edge server performance in a small form factor that is rugged and outdoor capable. It also takes the Intel Xeon D-2700 processors, with up to 20 cores even deeper into the realm of real-time demanding mixed-critical applications. Compared to the already available larger (200x160mm) COM-HPC Server Size E modules, the number of supported DRAM modules is halved from 8 to 4 bars. Nevertheless, impressive 512 GB of…
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Highly powerful, yet passively cooled
congatec – a leading vendor of embedded and edge computing technology – introduces seven less power-hungry variants of the 12th Generation Intel Core IOTG mobile processors (formerly codenamed Alder Lake) on 7 new COM-HPC and COM Express Computer-on-Modules each. Featuring the new Intel hybrid architecture with its mix of performance cores (P-cores) and efficient cores (E‑cores), the BGA-solderable processor variants consume just 15 to 28 W base power, which enables engineers to utilize them in fully passively cooled embedded and edge computing platforms. This eliminates the need for costly cooling options and improves the ruggedness and MTBF of system designs. The lower energy consumption is mainly achieved by reducing the number…
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Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements
At embedded world 2022 (hall 5, booth 135), congatec – a leading vendor of embedded and edge computing technology – and System Industrie Electronic (S.I.E) – an ISO 13485 certified expert in system design and integration, mass production and assembly of medical OEM platforms – have officially launched their new co-creation services for the design of IT/ OT systems dedicated for the medical and healthcare sector. The system engineering value of the collaboration between the two companies and its customers extends across the entire supply chain, from Computer-on-Modules to series production of certified system platforms. The joint offering targets medical device manufacturers and infrastructure solution providers requiring patient, data, and…
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Functional safe computing platforms for mixed-critical applications
At embedded world Hall 5/Booth 135, congatec – a leading vendor of embedded and edge computing technology – announced that it is making massive investments in functional safety (FuSa). Functionally safe embedded computing platforms are needed in many new applications ranging from industrial machinery and collaborative robotics to autonomous vehicles on shopfloors, rails, and roads. For all of these applications there is also a trend towards hardware consolidation that leads to the need to operate mixed-critical applications on functionally safe multicore embedded systems to manage multiple safety and non-safety critical tasks in parallel. Embedded x86 multicore platforms deliver a solid basis for such applications, which is why congatec now qualifies…
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congatec simplifie les déploiements d’Arm avec i.MX 8M Plus
congatec – un des principaux fournisseurs de technologies informatiques embarquées et de périphérie – annonce que ses Computer-on-Modules SMARC basés sur le processeur i.MX8 M Plus de NXP ont obtenu la certification SystemReady IR dans le cadre du projet Cassini mené par Arm. Ce projet vise à surmonter les obstacles aux déploiements Arm en fournissant un écosystème complet et sécurisé de normes, tout en offrant une expérience logicielle "cloud-native" semblable à celle d’un magasin d’applications, avec des routines de téléchargement, d’installation et d’exécution faciles en quelques clics seulement. En tirant parti d’un logiciel qui permet la diversité du matériel et fournit de puissantes API de sécurité et de certification, les…
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congatec simplifies Arm deployments with i.MX 8M Plus
congatec – a leading vendor of embedded and edge computing technology – announces that its SMARC Computer-on-Modules based on NXP i.MX8 M Plus processor technology have achieved SystemReady IR certification within the Arm driven Cassini project. The project aims to overcome the barriers of Arm deployments by providing a comprehensive and secure ecosystem of standards while delivering a cloud-native software experience similar to an app store with easy download, install and run routines with only a few clicks. By leveraging software that allows hardware diversity and provides powerful security APIs and certification, OEMs benefit from reduced development effort and time to market as they can now port and deploy their…
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TSN synchronized real-time over 5G
congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new Computer-on-Modules for 5G connected smart factories and industrial automation at Smart Factory & Automation World, Coex Hall C, Booth C522. Designed to simplify and accelerate the development of collaborative robotics and material handling systems, the smart mobility platforms from congatec are suitable for deployment in outdoor temperatures from -45°C to +85°C. Typical targets for these platforms range from next generation of real-time connected, functionally safe self-driving vehicles, to smart manufacturing and material handling applications ranging from collaborative and cooperative robots to substitutive solutions such as robots for THT assembly of PCB boards. OEM…
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TSN-synchronisierte Echtzeit über 5G
congatec – ein führender Anbieter von Embedded- und Edge-Computer-Technologie – stellt auf der Smart Factory & Automation World (Coex-Halle C, Stand C522) neue Computer-on-Modules für 5G-vernetzte smarte Fabriken und die industrielle Automatisierung vor. Die smarten Mobilitätsplattformen von congatec vereinfachen und beschleunigen die Entwicklung kollaborativer Robotik und Materialhandling-Systeme und sind für den Einsatz in Außentemperaturbereichen von -45°C bis +85°C ausgelegt. Typische Target-Systeme für diese Plattformen sind echtzeitvernetzte und funktional sichere selbstfahrende Fahrzeuge der nächsten Generation sowie intelligente Fertigungs- und Materialhandling-Systeme, die von kollaborativen und kooperativen Robotern bis hin zu substitutiven Robotik-Systemen für die THT-Bestückung von Leiterplatten reichen. OEM-Anbieter von intelligenten Logistikfahrzeugen und Fertigungsrobotern der nächsten Generation haben bei der Entwicklung solcher…
