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Supervisory Board extends contracts ahead of time for Volker
The Supervisory Board of LayTec AG has extended the contracts of the two members of the Managing Board ahead of schedule: Volker Blank and Dr. Kolja Haberland were appointed for additional five years to continue in their current role. This decision of the Supervisory Board is a clear signal of continuity and stability, essential for the further growth and development of LayTec. “We are looking back on two successful years and are ready to take on new challenges. As part of our roadmap, we are intensively working on product diversification by implementing new products for new applications to position LayTec even more strongly for the future”, says Kolja Haberland. “Our…
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LayTec to present its new EpiX cassette-to-cassette (C2C) mapping station at ICMOVPE XX in Stuttgart, Germany
After introducing its EpiX mapping station some years ago, LayTec is now bringing its newest EpiX generation to the market. The first demo unit of this novel metrology system will be displayed at LayTec‘s booth at ICMOVPE XX in Stuttgart, Germany from 10-14 July 2022. Just like previous EpiX generations, the novel system is equipped with white light reflectance and multi-wavelengths photoluminescence spectroscopy for wafer inspection. Now the system has been equipped with fully automated wafer handling and cassette-to-cassette wafer loading to also serve the requirements of high-throughput industrial applications. Detailed information can be found in the new EpiX data sheet. Dr. Johannes Zettler will also give a detailed presentation…
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Knowledge and Power: Oxford Instruments Plasma Technology and LayTec join forces to provide critical front end processing solutions for the production of compound semiconductor devices
Two technology leaders within the compound semiconductor industry, Oxford Instruments Plasma Technology and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTec’s accuracy and control with Oxford Instruments’ renowned wafer processing expertise. Together, they will combine plasma process solutions with proven in-situ metrology to achieve next generation device performance and enable a repeatable HVM process to shorten customers’ yield ramp. LayTec will develop the in-situ metrology while Oxford Instruments will integrate LayTec’s control with its advanced wafer processing solutions to deliver an enhanced solution to the customer. Driven by…
