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Pac Tech Asia investiert in den Ausbau der Dienstleistungskapazitäten in Malaysia
PacTech – Packaging Technologies GmbH (PacTech), ein renommierter Hersteller von lasergestützten Solder-Jetting- und Chip-Bonding-Anlagen sowie weltweit agierender Wafer-Level-Packaging-Dienstleister, freut sich, eine Investition von 10 Millionen US-Dollar zur Erweiterung der Kapazität seiner Tochtergesellschaft, PacTech Asia Sdn. Bhd. (PacTech Asia), mit Sitz in Penang, Malaysia, bekannt zu geben. Mit der erwarteten Erholung des Halbleitermarktes im Geschäftsjahr 2024 und einem prognostizierten Anstieg der Nachfrage von Key Customers erweitert PacTech strategisch seinen Geschäftsbereich innerhalb der südostasiatischen Lieferkette. Diese Expansion beinhaltet bedeutende Investitionen, einschließlich 10 Millionen US-Dollar für die Erweiterung des Reinraums auf insgesamt 2.000m2, modernste Ausrüstung und Fabrikautomation. Diese Verbesserungen der Fertigungskapazitäten von PacTech Asia werden zu einem erheblichen Anstieg der Wafer Bumping Kapazität…
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Pac Tech Asia Invests in Capacity Expansion of Malaysian Factory
Pac Tech Packaging Technologies GmbH (PacTech), a leading manufacturer of high-performance laser-assisted solder jetting and die bonding equipment, and a globally recognized wafer level packaging subcontractor, is proud to announce a $10 million investment to enhance the capacity of its subsidiary, PacTech Asia Sdn. Bhd. (PacTech Asia), located in Penang, Malaysia. With the semiconductor market poised for recovery in FY-2024 and a surge in demand anticipated from key customers, PacTech is strategically expanding its business footprint within the Southeast Asian supply chain. This expansion involves significant investments, including $10 million in additional cleanroom space totaling 20,000 sqft, cutting-edge equipment, and factory automation. These enhancements to PacTech Asia’s manufacturing capabilities will…
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Pac Tech – Packaging Technologies GmbH Appoints New Vice Presidents to Lead Business Units
Pac Tech – Packaging Technologies GmbH (PacTech), a renowned manufacturer of high-performance laser-assisted solder jetting and die bonding equipment, along with its role as a globally operating wafer level packaging subcontractor, proudly announces the internal promotions of Ms. Sy Jiun Sim and Mr. Matthias Fettke as Vice Presidents to lead key business units. Dr. Thorsten Teutsch, CEO of PacTech, expressed his vision for the company’s future, stating, “Our intent is to strengthen our engineering leverage through 2024, enhancing middle management and leadership across all business units and sites. We are incredibly proud to recognize the exceptional talents of Sy Jiun and Matthias, who have been cultivated within PacTech. This decision…
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Forming of Advanced THT-Interconnects using SB² Laser Solder Jetting Process
Conventional methods of soldering THT-contacts face growing limitations with new-generation products. Finer pitches, more intricate geometries, more excellent aspect ratios, thermally sensitive substrates, and an overall call for a flux-free bonding require different process solutions. SB² laser assisted solder jetting process addresses these challenges and overcomes them. The process involves jetting a molten solder droplet onto a THT contact. The solder fills the cavity between the pin and the inside of the vertical interconnect access (VIA), forming a reliable mechanical and electrical connection. This pitch-agnostic process works for various 2D and 3D geometries. It has several critical advantages over wave soldering, the conventional industrial solution to soldering THT contacts. Beside the…
